publication venue for
- 3D Stacking of SiC Integrated Circuit Chips with Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications 2022
- A Die Attach Design for Thermoelectric Generator Packages for Automotive Applications. 11:134-143. 2021
- Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects. 5:991-1005. 2015
- Thermal Cycling Reliability Study of Ag-In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes. 4:1420-1426. 2014