Chemical mechanical planarization for Cu through-wafer interconnects - An investigation of slurry chemistry interaction effects using a design of experiments approach Academic Article uri icon

Overview

publication date

  • 2006

has restriction

  • Copyright 2015 - Thomson Reuters. All rights reserved. You may not reproduce or redistribute this data in whole or in part without the written consent of Thomson Reuters.

Identity

Additional Document Info

start page

  • G211

end page

  • G217

volume

  • 153

issue

  • 3