Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses Conference Paper

Link to Conference Paper

Overview

authors

publication date

June 20, 2013

published in

2013 IEEE Workshop on Microelectronics and Electron Devices (WMED) Proceedings

Identity

Digital Object Identifier (DOI)

10.1109/WMED.2013.6544506

Additional Document Info

start page

9

end page

12