Fabrication of Micro Vias for LTCC Substrates Academic Article

• Link to Article via DOI

Overview

authors

• Wang, Gangqiang
• Folk, Erica C
• Barlow, Fred
• Elshabini, Aicha

publication date

• January 30, 2006

published in

• IEEE Transactions on Electronics Packaging Manufacturing  Journal

Identity

Digital Object Identifier (DOI)

• 10.1109/TEPM.2005.862633

Additional Document Info

start page

• 32

end page

• 41

volume

• 29

issue

• 1