selected publications
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academic article
- A comparison of back grinding processes for bare silicon and through-silicon via wafers using numerical simulations. Journal of Microelectronics and Electronic Packaging. 8:146-153. 2011
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book
- Field Guide for Integrated Pest Management for Hops. Oregon State University. 2009
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conference paper
- Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses. 2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). 9-12. 2013