selected publications
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academic article
- A Die Attach Design for Thermoelectric Generator Packages for Automotive Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 11:134-143. 2021
- Thermal Cycling Reliability Study of Ag-In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes. IEEE Transactions on Components Packaging and Manufacturing Technology. 4:1420-1426. 2014