date/time interval
- July 1, 2010 - June 30, 2011
Development of a Lead Free Die and Substrate Attach for High Temperature SiC Packages
Grant
Overview
awarded by
total award amount
- $96,086
People
contributor
- Barlow, Fred Principal Investigator 2010 - 2011
- Elshabini, Aicha Co-Principal Investigator 2010 - 2011