selected publications
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academic article
- Microstructural Effects during Chemical Mechanical Planarization of Copper. Journal of the Electrochemical Society. 157:H120-H126. 2010
- Integrating through-wafer interconnects with active devices and circuits. IEEE Transactions on Advanced Packaging. 31:4-13. 2008
- Chemical mechanical planarization for Cu through-wafer interconnects: An investigation of slurry chemistry interaction effects using a design of experiments approach. Journal of the Electrochemical Society. 153:G211-G217. 2006
- Polymer thickness effects on Bosch etch profiles. Journal of Vacuum Science and Technology B. 20:2229-2232. 2002
- Substitutionality of GE Atoms in Ion-Implanted ALSB. Applied Physics Letters. 66:2406-2408. 1995
- Characterization of Inactive Carbon in GAAS. Compound Semiconductors 1994. 269-274. 1994
- Amphoteric Substitutionality and Lattice Distortion of GE in INP. Applied Physics Letters. 64:1543-1545. 1994
- The Effect of Coimplantation on the Electrical Activity of Implanted Carbon in GAAS. Journal of Applied Physics. 74:7118-7123. 1993
- Coimplantation and Electrical Activity of C in GAAS - Stoichiometry and Damage Effects. Applied Physics Letters. 60:2383-2385. 1992
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conference paper
- Development of a Micro-nozzle and Ion Mobility Spectrometer in Ltcc. 2004 IEEE Workshop on Microelectronic and Electron Devices. 95-98. 2004