awards grant
- Analysis of Substrate and Wire Bond Technologies for High Temperature SiC Packages
- Development of a Lead Free Die and Substrate Attach for High Temperature SiC Packages
- Electronic Packaging of SiC devices for High Temperature Operation
- Equipment Grant
- Packaging of High Temperature Thermoelectric Devices
- Packaging of High Temperature Thermoelectric Devices
- Packaging of High Temperature Thermoelectric Devices: Assembly Methods