selected publications
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academic article
- Low Cost Flex Substrates for Miniaturized Electronic Assemblies. Microelectronics Reliability Journal. 42:1091-1099. 2002
- An Overview to Integrated Power Module (IPM) Design for High Power Electronics Packaging. Microelectronics Reliability Journal. 40:365-379. 2000
- Integrated Power Modules (IPMs), A Novel MCM Approach to High Power Electronics Design and Packaging. International Journal of Microcircuits and Electronic Packaging. 21:274-278. 1998
- Thermal Evaluation and Comparison Study of Power Baseplate Materials. Advancing Microelectronics. 25:25-27. 1998