Feng Li Clinical Associate Professor

academic article

• Flip chip die-to-wafer bonding review: gaps to high volume manufacturing.  Semiconductor Science and Information Devices.  4:8-13. 2022
• Signal and power integrity challenges for high density system-on-package.  Semiconductor Science and Information Devices.  4:1-9. 2022
• A Review of the Building Blocks of Silicon Photonics: from Fabrication Perspective.  Semiconductor Science and Information Devices.  1:29-35. 2019
• S Electrode Materials.  Encyclopedia of Inorganic and Bioinorganic Chemistry.  2019
• Numerical Simulation of High Electron Mobility Transistors based on the Spectral Element Method.  Applied Computational Electromagnetics Society Journal.  31:1144-1150. 2016
• Plasmon Resonance Effects in GaAs/AlGaAs Heterojunction Devices: An Analysis Based on Spectral Element Simulation.  IEEE Transactions on Electron Devices.  61:1477-1482. 2014

article

chapter

conference paper

• Wirebonding Based 3-D SiC IC Stacks for High Temperature Applications.  2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2023-2027. 2022
• Scaling Beyond 7nm Node: An Overview of Gate-All-Around FETs.  2021 9th International Symposium on Next Generation Electronics (ISNE). 1-6. 2021
• Microbump Processing for 3D IC Integration.  Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT. 1028-1049. 2019
• Recent advances in 3D packaging for medical applications.  19th International Conference on Electronic Packaging Technology. 1193-1197. 2018
• Scaling optical communication for on-chip interconnect.  19th International Conference on Electronic Packaging Technology. 1178-1183. 2018
• Technology review of system in package.  Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT. 1-20. 2017
• Fabrication and characterization of microwave immunosensors based on organic semiconductors with nanogold-labeled antibody.  Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2008. 2381-2384. 2008
• Growth of monolayered organic films for nanostructured nonlinear photonic devices.  Conference on Lasers and Electro-Optics (CLEO). 795-796. 2003