selected publications academic article Flip chip die-to-wafer bonding review: gaps to high volume manufacturing. Semiconductor Science and Information Devices. 4:8-13. 2022 Signal and power integrity challenges for high density system-on-package. Semiconductor Science and Information Devices. 4:1-9. 2022 A Review of the Building Blocks of Silicon Photonics: from Fabrication Perspective. Semiconductor Science and Information Devices. 1:29-35. 2019 S Electrode Materials. Encyclopedia of Inorganic and Bioinorganic Chemistry. 2019 Numerical Simulation of High Electron Mobility Transistors based on the Spectral Element Method. Applied Computational Electromagnetics Society Journal. 31:1144-1150. 2016 Plasmon Resonance Effects in GaAs/AlGaAs Heterojunction Devices: An Analysis Based on Spectral Element Simulation. IEEE Transactions on Electron Devices. 61:1477-1482. 2014 article chapter conference paper Wirebonding Based 3-D SiC IC Stacks for High Temperature Applications. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2023-2027. 2022 Scaling Beyond 7nm Node: An Overview of Gate-All-Around FETs. 2021 9th International Symposium on Next Generation Electronics (ISNE). 1-6. 2021 Microbump Processing for 3D IC Integration. Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT. 1028-1049. 2019 Recent advances in 3D packaging for medical applications. 19th International Conference on Electronic Packaging Technology. 1193-1197. 2018 Scaling optical communication for on-chip interconnect. 19th International Conference on Electronic Packaging Technology. 1178-1183. 2018 Technology review of system in package. Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT. 1-20. 2017 Fabrication and characterization of microwave immunosensors based on organic semiconductors with nanogold-labeled antibody. Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2008. 2381-2384. 2008 Growth of monolayered organic films for nanostructured nonlinear photonic devices. Conference on Lasers and Electro-Optics (CLEO). 795-796. 2003