date/time interval
- July 1, 2009 - June 30, 2010
Analysis of Substrate and Wire Bond Technologies for High Temperature SiC Packages
Grant
Overview
awarded by
total award amount
- $93,800
People
contributor
- Barlow, Fred Principal Investigator 2009 - 2010
- Elshabini, Aicha Co-Principal Investigator 2009 - 2010