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Co-investigator Network

Fred Barlow Person

Former Electrical and Computer Engineering Professor.

People

member of

• American Society of Engineering Educators Member
• Institute of Electrical and Electronics Engineers Senior Member
• International Microelectronics And Packaging Society Fellow
• Surface Mount Technology Association Member

Publications

selected publications

• academic article

  • Time Delay Extraction from Frequency Domain Data Using Causal Fourier Continuations for High-Speed Interconnects.  Electronics.  4:799-826. 2015
  • Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects.  IEEE Transactions on Components Packaging and Manufacturing Technology.  5:991-1005. 2015
  • Thermal Cycling Reliability Study of Ag-In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes.  IEEE Transactions on Components Packaging and Manufacturing Technology.  4:1420-1426. 2014
  • Causality verification using polynomial periodic continuations for electrical interconnects.  Journal of Microelectronics and Electronic Packaging.  11. 2014
  • Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter.  IEEE Transactions on Power Electronics.  28:1464-1478. 2013
  • Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC).  Journal of Microelectronics and Electronic Packaging.  10:95-101. 2013
  • Tunable Ferroelectric Capacitors Embedded Inside LTCC.  Advancing Microelectronics.  40:20-23. 2013
  • High Temperature SiC JFET Based Six-Pack Power Module for a Fully Integrated 50 kW Inverter.  IEEE Transactions on Power Electronics.  2012
  • A Novel Design of Substrate Integrated Waveguide (SIW) E-Plane Inductive Strip Filter Implemented Using LTCC.  Journal of Microelectronics and Electronic Packaging.  8. 2011
  • A comparison of back grinding processes for bare silicon and through-silicon via wafers using numerical simulations.  Journal of Microelectronics and Electronic Packaging.  8:146-153. 2011
  • SiC JFET dc Characteristics Under Extremely High Ambient Temperatures.  IEICE Electronics Express.  1:523-527. 2010
  • Fabrication of Precise Fluidic Structures in LTCC.  International Journal of Applied Ceramic Technology.  6:18-23. 2009
  • Power conversion with SiC devices at extremely high ambient temperatures.  IEEE Transactions on Power Electronics.  22:1321-1329. 2007
  • Fabrication of Micro Vias for LTCC Substrates.  IEEE Transactions on Electronics Packaging Manufacturing.  29:32-41. 2006
  • An Interdigital Bandpass Filter Embedded in LTCC for 5-GHz Wireless LAN Applications.  IEEE Microwave and Wireless Components Letters.  15:357-359. 2005
  • Switching characteristics of SiC JFET and Schottky diode in high-temperature dc-dc power converters.  IEICE Electronics Express.  2:97-102. 2005
  • Digital Communication Interface For An Automotive Application.  Latin American Applied Research.  35. 2005
  • Low Cost Flex Substrates for Miniaturized Electronic Assemblies.  Microelectronics Reliability Journal.  42:1091-1099. 2002
  • Chip Scale Packaging for Power Devices.  Advancing Microelectronics.  28. 2001
  • Interfacial Thermal Resistance and Temperature Dependence of Three Adhesives for Electronic Packaging.  IEEE Transactions on Components and Packaging Technologies.  23:633-637. 2000
  • Getting Aggressive with Passive Devices.  IEEE Circuits and Devices.  16:16-25. 2000
  • An Overview to Integrated Power Module (IPM) Design for High Power Electronics Packaging.  Microelectronics Reliability Journal.  40:365-379. 2000
  • Integrated Power Modules (IPMs), A Novel MCM Approach to High Power Electronics Design and Packaging.  International Journal of Microcircuits and Electronic Packaging.  21:274-278. 1998
  • Thermal Evaluation and Comparison Study of Power Baseplate Materials.  Advancing Microelectronics.  25:25-27. 1998
  • Wideband Electrical Characterization of MCM Materials.  Electronic Packaging and Production.  36:47-54. 1996
  • Wideband Electrical Characterization of Materials Used in MCM Applications.  International Journal of Microcircuits and Electronic Packaging.  19:281-287. 1996
  • Comprehensive Evaluation of ITO Thick Films Produced Under Optimum Annealing Conditions.  Solar Energy Materials and Solar Cells.  33:63-71. 1994

• chapter

  • Multilayer Ceramics.  Handbook of Ceramic Interconnect Technology. 2007
  • Ceramic Substrates.  Advanced Electronic Packaging. IEEE. 1100. 2006
  • Radio Frequency and Microwave Packaging.  Advanced Electronic Packaging. IEEE. 2006
  • Packaging of High-Speed and Microwave Electronic Systems.  Electronic Packaging and Interconnection Handbook. 2004
  • Advanced Packaging.  Coombs' Printed Circuit Handbook. 2001
  • Electronic Packaging: Semiconductor Packages.  The Encyclopedia of Materials: Science and Technology. 2001
  • Design Guidelines for Thin Film Components and Construction of Thin Film Modules.  Thin Film Technology Handbook. 1998
  • Film Deposition Techniques and Processes.  Thin Film Technology Handbook. 1998
  • Properties of Thin Film Materials.  Thin Film Technology Handbook. 1998
  • Thin Film Materials and Processing.  Handbook of Hybrid Microelectronics. 1994

• conference paper

  • Causality Enforcement of High-Speed Interconnects via Periodic Continuations.  IMAPS 2014 Conference. 2014
  • Zero Meta-Material Ferroelectric Phase Shifter Embedded inside LTCC.  IMAPS 2014 Conference. 2014
  • A New Method for Causality Enforcement of DRAM Package Models Using Discrete Hilbert Transforms.  2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). 21-24. 2013
  • Comparison of Passive Enforcement Techniques for DRAM Package Models.  2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). 25-28. 2013
  • Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses.  2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). 9-12. 2013
  • Comparison of Passive Enforcement Techniques for DRAM Package Models.  WMED 2013 Conference. 2013
  • Modeling of Failure in Aluminum Alloy Braze for a High Temperature Thermoelectric Assembly.  IMAPS 2013 Conference. 2013
  • Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses.  WMED 2013 Conference. 2013
  • Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments.  Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2012 conference. 12-17. 2012
  • Numerical Simulation of Heat Generation during the Back Grinding Process of Silicon Wafers.  2012 IEEE Workshop on Microelectronics and Electron Devices (WMED 2012). 5-8. 2012
  • Evaluation of Ceramic Substrates for High Power and High Temperature Applications.  Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2011 conference. 199-206. 2011
  • Finite Element Modeling of a Back Grinding Process for Through Silicon Vias.  2011 IEEE Workshop on Microelectronics and Electron Devices (WMED). 9-12. 2011
  • High Density 50 kW SiC Inverter Systems Using a JFETs Based Six-Pack Power Module.  8th International Conference on Power Electronics - ECCE Asia. 764-769. 2011
  • Numerical Simulation of a Back Grinding Process for Silicon Wafers.  3-12. 2011
  • Waveguide Inductive Strip Filter Embedded in LTCC.  Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2011 conference. 43-49. 2011
  • 18 kW Three Phase Inverter System Using Hermetically Sealed SiC Phase-Leg Power Modules.  IEEE Applied Power Electronics Conference. 1108-1112. 2010
  • Develop Procedure for Designing Fourth Order Microstrip Dual-Mode Bandpass Filters.  2010 Microwave Mediterranean Symposium (MMS). 236-240. 2010
  • High Power SiC Modules for HEVs and PHEVs.  International Power Electronics Conference (IPEC)- ECCE Asia Proceedings. 2010
  • Design methodology for designing second order microstrip dual-mode filters.  2009 Microwave Mediterranean Symposium (MMS). 1-5. 2009
  • Encapsulation of Power Modules for Extreme Environments.  2009 International Microelectronics and Packaging Conference. 678-685. 2009
  • SiC-Based Inverter for High Efficiency and High Temperature Operation.  Advanced Workshop on 'Frontiers in Electronics' (WOFE 09). 2009
  • Advanced Laser Diode Cooling Concepts.  2008 MRS Spring Meeting. 2008
  • Fabrication of Precise Fluidic Structures in LTCC.  Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2008 conference. 183-188. 2008
  • Leakage Rates through LTCC Substrates for Extreme Environment Applications.  2008 International Microelectronics and Packaging Conference. 1147-1151. 2008
  • SiC&GaN Die Attach for Extreme Environment Electronics.  2008 International Microelectronics and Packaging Conference. 1119-1125. 2008
  • High-Temperature SiC Packaging For HEV Traction Applications.  2007 International Microelectronics and Packaging Conference. 2007
  • High-Temperature SiC Packaging For Power Electronic Applications.  XXXI International Conference of IMAPS Poland Chapter. 2007
  • Micro-fluidic Optoelectronic Packages based on LTCC.  2007 International Microelectronics and Packaging Conference. 429-436. 2007
  • Characterization of SiC Diodes in Extremely High Temperatures Ambient.  Applied Power Electronics Conference Exposition. 441-447. 2006
  • Future Trends in Electronic Packaging.  Smart Structures and Materials 2006. 2006
  • Investigation of the Via fill Process for High Density Multilayer LTCC Substrates.  2006 International Microelectronics and Packaging Conference. 2006
  • Low Temperature Co-Fired Ceramics in Electrochemical Applications.  209th ECS Meeting. 2006
  • Warfighter Security In Commercial Satellite Networks Through Signal Path Diversity.  2006 Space Conference. 2006
  • A novel packaging methodology for spray cooling of power semiconductor devices using dielectric liquids.  Applied Power Electronics Conference and Exposition, 2005. 2014-2018. 2005
  • Computer Modeling of Liquid Droplet Impact on Heat Transfer During Spray Cooling.  ASME Summer 2005 Heat Transfer Conference (HT2005). 2005
  • Interconnection of Fine Lines to Micro Vias in High Density Multilayer LTCC Substrates.  2005 International Microelectronics and Packaging Conference. 2005
  • Modeling-based design optimization of wafer-level and chip-scale packaging for RF-MEMS devices.  Electronic Components and Technology, 2005. 1814-1818. 2005
  • Power Conversion with SiC Diodes at Extremely High Ambient Temperatures.  PESC 05. 2005
  • A Microjet Array Air Impingement Cooling Package Fabricated using Low Temperature Cofired Ceramic.  Imaps Ceramics Conference 2004. 2004
  • Die Attach for High Temperature SiC Devices.  IMAPS International Conference on High Temperature Electronics (HiTEC 2004). 2004
  • Embedded Passives in LTCC for RF & Microwave Applications.  European Microelectronics and Packaging Symposium. 2004
  • Embedded Passives in LTCC for RF & Microwave Applications.  European Microelectronics and Packaging Symposium. 2004
  • Fabrication and Numerical Design of MEMS Based Silicon Micro-Jet Array Impingement Coolers.  IMAPS International Conference on High Temperature Electronics (HiTEC 2004). 2004
  • Fundamental Issues in processing and Applications of Low Temperature Cofired ceramic Tape.  XXVIII International Conference of IMAPS Poland Chapter. 19-29. 2004
  • Integrated motors and controllers for 42 V automotive auxiliary motor applications.  Power Electronics in Transportation. 97-102. 2004
  • LTCC Based Front-End receiver for 5-GHz WLAN Applications.  Imaps Ceramics Conference 2004. 2004
  • LTCC Based Front-End receiver for 5-GHz WLAN Applications.  Imaps Ceramics Conference 2004. 2004
  • Micro Vias In LTCC Substrates.  Imaps Ceramics Conference 2004. 2004
  • Some Considerations in High Power Motor Drive Systems for Ship Propulsion.  Electric Machine Technology Symposium (EMTS) 2004. 2004
  • Some considerations in high power motor drive systems for ship propulsion.  ASME 2004. 2004
  • Considerations in Developing Electrochemical Microimmunoassays Based on Low Temperature Co-Fired Ceramic Materials.  PITCON 2003. 2003
  • Electronic Packaging Education at the University of Arkansas: Status After 10 years.  ECTC 2003. 2003
  • Embedded Passives in Low-Temperature Co-Fired Ceramic for RF & Microwave Applications.  2003 International Microelectronics and Packaging Conference. 2003
  • LTCC Based MEMS impingement Coolers.  IMAPS Ceramics Conference 2003. 2003
  • LTCC Based Slow Wave Filters For Wireless and Handheld Products.  14th European Microelectronic & Packaging Conference. 2003
  • LTCC Based Slow Wave Filters For Wireless and Handheld Products.  IMAPS Ceramics Conference 2003. 2003
  • Process and Material Challenges Associated with the Next generation of LTCC Based Products.  Electrochemical Society (ECS) Fall Meeting. 2003
  • Alternative Z-axis connector technologies for high-density 3-D packaging.  Electronic Components and Technology Conference, 2002. 1106-1109. 2002
  • MCM- D/C Based on Cu/ BCB Thin Film and LTCC: Lessons Learned.  2002 Proceedings of the International Symposium on Microelectronics. 2002
  • Mixed-Signal/Telecommunications Curriculum Development and Internet2 Delivery.  2002 American Society for Engineering Education Annual Conference & Exposition. 2002
  • Modeling and control of resistance tolerance for embedded resistors in LTCC.  Electronic Components and Technology Conference. 2002
  • Simulation, Characterization and Design of Embedded Resistors in LTCC for High Frequency Applications.  International Symposium on Microelectronics. 2002
  • 3D Packaging for High-Density Processing.  GOMAC 2001. 2001
  • Effect of Design and Processing Parameters on Buried Resistors in LTCC Systems.  International Symposium on Microelectronics. 2001
  • Z-axis Interconnection for 3-D High-Density Packaging.  2001 Proceedings of the International Symposium on Microelectronics. 2001
  • A Micromachined Ball Grid Array Test Socket for Fine-Pitch Interconnect.  International Conference on Microelectronics. 172-177. 2000
  • A flip chip power electronic packaging technology on a flexible substrate.  EPTC 2000. 2000
  • Curriculum restructure to answer critical needs in packaging for energy efficiency/renewable energy systems, wireless, and mixed-signal systems areas.  50th ECTC. 1278-1284. 2000
  • Integral Passives Development at The University of Arkansas: The State of the Art.  APEX 2000. 2000
  • Investigation of Wirebonds on Insulated-Metal Substrate for Multichip Power Module Applications.  International Conference on Microelectronics. 99-104. 2000
  • Polymer Thick Film (PTF) and Flex Technologies for Low Cost Power Electronics Packaging.  International Workshop on Integrated Power Packaging (IWIPP). 2000
  • Z-axis interconnections for high density processors.  5th VLSI Packaging Workshop of Japan. 2000
  • Z-axis interconnections for high density processors, Part 1.  2000 International conference on high-density interconnect and systems packaging. 14-19. 2000
  • Ceramic interconnection substrate technology.  National Electronic Packaging and Production Conference. 889-912. 1999
  • The Utilization of Polymer Thick Film (PTF) and Flex Technologies for Low Cost Power Electronics Packaging of DC/DC Down Converters.  International Symposium on Microelectronics. 1999
  • UBM Formation on Single Die/Dice for Flip Chip Applications.  International Symposium on Microelectronics. 1999
  • A Compact Low Voltage High Current Power Supply for Digital Applications.  International Symposium on Microelectronics. 138-143. 1998
  • Evaluation of a Novel Polyimide for Use as a Low-Loss, Low Dielectric Constant Interlayer in Electronic Packaging Applications.  International Symposium on Microelectronics. 230-235. 1998
  • Low Dielectric Constant Thick Film Silver and Gold Systems thick film substrates for electronic packaging applications.  International Symposium on Microelectronics. 795-801. 1998
  • Multilayer Interconnects for a High Power Packaging Strategy.  International Symposium on Microelectronics. 330-334. 1998
  • Electronic Packaging for Power Electronic Building Blocks (PEBB).  Government Microcircuits Applications Conference (GOMAC). 1997
  • Materials issues for Packaging of Power Electronic Building Blocks.  Third International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties, and Interfaces. 1997
  • Materials issues for Packaging of Power Electronic Building Blocks.  Third International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties, and Interfaces. 1997
  • Microelectronics and Electronic Packaging Education and Research at Virginia Tech.  IEEE-ECTC Conference. 1997
  • Electronic Packaging Solutions for Power Electronic Building Blocks (PEBB).  International Symposium on Microelectronics (ISHM '96),. 359-364. 1996
  • Electronic Packaging of Power Electronic Building Blocks (PEBB).  Fourteenth Annual Power Electronics Seminar. 1996
  • Underwater Digital Signal Processing Unit Implementing MCM-C Technology.  International Conference on Multichip Modules. 95-99. 1995
  • Wideband Electrical Characterization of Materials Used in MCM Applications.  International Symposium of Hybrid Microelectronics (ISHM '95). 1995
  • Materials and Processes for MCM Applications.  Electronic Materials and Processing (EM&P) conference. 1994
  • Thick Film Cerium Oxide Buffer Layers for High Temperature Superconductors.  International Symposium of Hybrid Microelectronics (ISHM '94). 161-166. 1994
  • A Novel Method for the Production of High Temperature Superconducting Multichip Modules.  25th Government Microcircuit Applications Conference (GOMAC). 581-584. 1993
  • High Frequency Characterization of Thick Film Superconductors.  8th Electronic Materials and Processing Congress. 27-33. 1993

• conference poster

  • Microwave Imaging System for Breast Cancer Detection.  Arkansas Biosciences Institute Conference. 2004
  • Poster Presentation.  Engineering & Computing Education Grantee Meeting 2003. 2003

• patent

  • Microfluidic Device Utilizing Magnetohydrodyanmics and Method for Fabrication Thereof 2007

• patent disclosure

  • Spectrally Accurate Causality Enforcement using SVD-based Fourier Continuations for High Speed Digital Interconnects 2014
  • Causality Verification and Enforcement of Microelectronic Packages Macromodels using Discrete Hilbert Transform on Periodically Continued Data 2013
  • DRAM Packages Modeling Synthesis to Verify Passivity and Interpolate the Data using Singular Value Decomposition 2013
  • Band-Pass Filter Using Air-filled Substrate-Integrated Waveguide in LTCC 2011
  • Substrate-Integrated Waveguide Filter Implemented Using Low Temperature Co-fired Ceramic 2011
  • A Spray Cooled Flip Chip Power Package 2006
  • Package for High Power SiC Semiconductor Power Devices 2006
  • Motor Drive Semiconductor Power Device Package Utilizing Thermal Spray Technology 2005
  • Air Microjet Array Cooled Packaging Based on Low Temperature Co-Fired Ceramic 2004
  • High Power Flip Chip Package 2004
  • High Power Interconnects in Low Temperature Co-fired Ceramic Substrates 2004
  • Integrated Power Module 2004
  • LTCC Based Front-End Receiver for 5 GHz WLAN Applications 2004
  • Tight Tolerance Embedded Slot Resistors in Low Temperature Co-fired Ceramics 2004

• provisional patent

  • A Microjet Array Air Impingement Cooling Package Fabricated Using Low Temperature Co-Fired Ceramic 2005

• report

  • High-Temperature High-Power Packaging Techniques for HEV Traction Applications 2006

editor of

• book

  • Handbook of Ceramic Interconnect Technology 2007
  • Thin Film Technology Handbook 1998

presentations

• invited talk

  • Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments, Speaker, 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2012
  • 2 MacroNano-Colloquium on Ceramic Microsystems & Project Status, Speaker, Seminar on Ceramic Microwave Circuits for Satellite Communications (KERAMIS II) 2009

• presentation

  • Advancements in Electronic Packaging, Speaker, Emerging Microelectronics and Interconnection Technology 2008
  • Fabrication of Precise Fluidic Structures in LTCC, Speaker, Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2008 conference 2008
  • SiC & GaN Die Attach for Extreme Environment Electronics, Speaker, 2008 International Microelectronics and Packaging Conference 2008
  • “Leakage Rates through LTCC Substrates for Extreme Environment Applications, Speaker, 2008 International Microelectronics and Packaging Conference 2008
  • Applications of Materials in Microelectronics, Speaker, University of Idaho ASM/TMS Student Chapter 2007
  • High-Temperature SiC Packaging For HEV Traction Applications, Speaker, 2007 International Microelectronics and Packaging Conference 2007
  • High-Temperature SiC Packaging For Power Electronic Applications, Speaker, XXXI International Conference of IMAPS Poland Chapter 2007
  • Investigation of the Via fill Process for High Density Multilayer LTCC Substrates, Speaker, 2006 International Microelectronics and Packaging Conference 2006
  • Interconnection of Fine Lines to Micro Vias in High Density Multilayer LTCC Substrates, Speaker, 2005 International Microelectronics and Packaging Conference 2005
  • Micro Vias In LTCC Substrates, Speaker, Imaps Ceramics Conference 2004 2004
  • Microwave Imaging System for Breast Cancer Detection, Speaker, Biomedical Forum III 2004
  • Design and Materials Selection for RF and Microwave Micromodules, Speaker, Seminar Series on RF and Microwave Modules 2003
  • Latest Advances in Ceramic Interconnect Technologies: Thermal Design Tradeoffs, Speaker, IEEE MTT Annual Meeting 2003
  • Process and Material Challenges Associated with the Next generation of LTCC Based Products, Speaker, Electrochemical Society (ECS) Fall Meeting 2003
  • Spray Cooling For High Power Shipboard Systems, Speaker, Office Of Naval Research Invited Thermal Workshop 2003
  • Keynote Presentation – Past, Present and Future of RF Packaging, Speaker, Devices and Packaging for Wireless Communications Workshop 2002

featured in

• [Faculty feature] Fred Barlow  Webpage

Research

research overview

• Total Value Secured to Date as PI or Co-PI: $7,632,529

principal investigator on

• Acquisition of an Adaptive Computation Server for Support of STEM Research at the University of Idaho  awarded by NSF Major Research Instrumentation Program 2012 - 2015
• MRI: Acquisition of an Adaptive Computation Server for Support of STEM Research at the University of Idaho  awarded by NSF Division of Computer and Network Systems (CNS) 2014
• Establishment of the Micron Endowed Professorship in Microelectronics at University of Idaho  awarded by Micron Foundation 2014
• Materials and Supplies Donation  awarded by Micron Foundation 2014
• High Speed Digital Package Measurement and Modeling for Next Generation Memory Modules  awarded by Idaho Global Entrepreneurial Mission 2013 - 2014
• Packaging of High Temperature Thermoelectric Devices  awarded by II-VI Foundation 2013 - 2014
• Scholarship funding for Ph.D. Students from Egypt  awarded by Egyptian Military Technical College 2009 - 2014
• Micron Technology Foundation Grant  awarded by Micron Foundation 2012 - 2013
• Packaging of High Temperature Thermoelectric Devices: Assembly Methods  awarded by II-VI Foundation 2012 - 2013
• Micron Technology Foundation Grant  awarded by Micron Foundation 2011 - 2012
• Packaging of High Temperature Thermoelectric Devices  awarded by II-VI Foundation 2011 - 2012
• Equipment Grant  awarded by II-VI Foundation 2011
• Development of a Lead Free Die and Substrate Attach for High Temperature SiC Packages  awarded by II-VI Foundation 2010 - 2011
• Micron Technology Foundation Grant  awarded by Micron Foundation 2008 - 2011
• Silicon Carbide Inverters Phase III  awarded by Global Power Electronics (GPE), Inc. 2009 - 2010
• Analysis of Substrate and Wire Bond Technologies for High Temperature SiC Packages  awarded by II-VI Foundation 2009 - 2010
• Inertial Sensors Prototypes  awarded by MET Tech, Inc. 2009
• Silicon Carbide Inverters: Phase II  awarded by Global Power Electronics (GPE), Inc. 2009
• Electronic Packaging of SiC devices for High Temperature Operation  awarded by II-VI Foundation 2008 - 2009
• Silicon Carbide Inverters  awarded by Global Power Electronics (GPE), Inc. 2008
• LTCC Packaging for Laser Diode Bars  awarded by Northrop Grumman 2007
• High Temperature Packaging of SiC Devices  awarded by United States Department of Energy 2007
• LTCC Packaging for Laser Diode Bars  awarded by Northrop Grumman 2006 - 2007
• High Temperature Packaging Study  awarded by Freedom Car Program 2005 - 2006
• Microvia in LTCC  awarded by Honeywell Federal Systems 2005
• Integrated Controllers for Automotive Auxiliary Electric Motors  awarded by United States Department of Energy 2002 - 2003
• Characterization And Modeling of Embedded Passives In Low-Temperature Co-Fired Ceramic  awarded by International Microelectronics And Packaging Society 2002 - 2003
• Low Temperature Co-Fired Ceramic (LTCC) Training Program  awarded by Gintic Institute of Manufacturing Technology 2002
• High Performance On-Chip Decoupling Capacitors  awarded by Integral Wave Technologies, Inc. 2000 - 2002

co-principal investigator on

• Prediction and Monitoring Systems of Creep-Fracture Behavior of 9Cr-1Mo Steels for Reactor Pressure Vessels  awarded by Nuclear Energy University Programs (NEUP) 2009 - 2012
• Wafer-Level and Chip-Scale Packaging (WL-CSP) of MEMS  awarded by National Science Foundation 2005 - 2007
• Power Packaging of Spray-Cooled SiC Devices for High Temperature and High Voltage Operation  awarded by Office of Naval Research 2004 - 2007
• National Center for Reliable Electric Power Transmission (NCREPT) 2005
• Innovative Microwave Imaging System for Breast Cancer Detection  awarded by Arkansas Biosciences Institute (ABI) 2004 - 2005
• Incorporating Recent Developments into Mixed- Signal / Telecommunications Curriculum  awarded by National Science Foundation 2001 - 2004
• DOD-DEPSCOR: Direct Cooling of Propulsion Drives  awarded by Office of Naval Research 2001 - 2003
• Enhancing Prototyping Capabilities for Electric Propulsion Research at the University of Arkansas  awarded by Office of Naval Research 2000

Background

education and training

• B.S. in Physics and Applied Physics, Emory University
• M.S. in Electrical Engineering, Virginia Polytechnic Institute
• Ph.D. in Electrical Engineering, Virginia Polytechnic Institute

awards and honors

• John A. Wagnon Technical Achievement Award, conferred by International Microelectronics And Packaging Society, 2011
• Fellow of the Society by the International Microelectronics And Packaging Society, conferred by International Microelectronics And Packaging Society, 2009
• George Abraham Outstanding Paper Award, conferred by GOMACTech Conference, 2001
• Technical Achievement Award, conferred by International Microelectronics And Packaging Society, 1997
• Outstanding Service to Students Award, conferred by University of Arkansas, 2005 - 2006
• Outstanding Teacher Award, conferred by University of Arkansas, 2002 - 2003

Contact

full name

• Fred Barlow, III