Fred Barlow Person
Former Electrical and Computer Engineering Professor.
People
Publications
selected publications
editor of
presentations
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invited talk
- Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments, Speaker, 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2012
- 2 MacroNano-Colloquium on Ceramic Microsystems & Project Status, Speaker, Seminar on Ceramic Microwave Circuits for Satellite Communications (KERAMIS II) 2009
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presentation
- Advancements in Electronic Packaging, Speaker, Emerging Microelectronics and Interconnection Technology 2008
- Fabrication of Precise Fluidic Structures in LTCC, Speaker, Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2008 conference 2008
- SiC & GaN Die Attach for Extreme Environment Electronics, Speaker, 2008 International Microelectronics and Packaging Conference 2008
- “Leakage Rates through LTCC Substrates for Extreme Environment Applications, Speaker, 2008 International Microelectronics and Packaging Conference 2008
- Applications of Materials in Microelectronics, Speaker, University of Idaho ASM/TMS Student Chapter 2007
- High-Temperature SiC Packaging For HEV Traction Applications, Speaker, 2007 International Microelectronics and Packaging Conference 2007
- High-Temperature SiC Packaging For Power Electronic Applications, Speaker, XXXI International Conference of IMAPS Poland Chapter 2007
- Investigation of the Via fill Process for High Density Multilayer LTCC Substrates, Speaker, 2006 International Microelectronics and Packaging Conference 2006
- Interconnection of Fine Lines to Micro Vias in High Density Multilayer LTCC Substrates, Speaker, 2005 International Microelectronics and Packaging Conference 2005
- Micro Vias In LTCC Substrates, Speaker, Imaps Ceramics Conference 2004 2004
- Microwave Imaging System for Breast Cancer Detection, Speaker, Biomedical Forum III 2004
- Design and Materials Selection for RF and Microwave Micromodules, Speaker, Seminar Series on RF and Microwave Modules 2003
- Latest Advances in Ceramic Interconnect Technologies: Thermal Design Tradeoffs, Speaker, IEEE MTT Annual Meeting 2003
- Process and Material Challenges Associated with the Next generation of LTCC Based Products, Speaker, Electrochemical Society (ECS) Fall Meeting 2003
- Spray Cooling For High Power Shipboard Systems, Speaker, Office Of Naval Research Invited Thermal Workshop 2003
- Keynote Presentation – Past, Present and Future of RF Packaging, Speaker, Devices and Packaging for Wireless Communications Workshop 2002
featured in
- [Faculty feature] Fred Barlow Webpage
Research
research overview
- Total Value Secured to Date as PI or Co-PI: $7,632,529
principal investigator on
- Acquisition of an Adaptive Computation Server for Support of STEM Research at the University of Idaho awarded by NSF Major Research Instrumentation Program 2012 - 2015
- MRI: Acquisition of an Adaptive Computation Server for Support of STEM Research at the University of Idaho awarded by NSF Division of Computer and Network Systems (CNS) 2014
- Establishment of the Micron Endowed Professorship in Microelectronics at University of Idaho awarded by Micron Foundation 2014
- Materials and Supplies Donation awarded by Micron Foundation 2014
- High Speed Digital Package Measurement and Modeling for Next Generation Memory Modules awarded by Idaho Global Entrepreneurial Mission 2013 - 2014
- Packaging of High Temperature Thermoelectric Devices awarded by II-VI Foundation 2013 - 2014
- Scholarship funding for Ph.D. Students from Egypt awarded by Egyptian Military Technical College 2009 - 2014
- Micron Technology Foundation Grant awarded by Micron Foundation 2012 - 2013
- Packaging of High Temperature Thermoelectric Devices: Assembly Methods awarded by II-VI Foundation 2012 - 2013
- Micron Technology Foundation Grant awarded by Micron Foundation 2011 - 2012
- Packaging of High Temperature Thermoelectric Devices awarded by II-VI Foundation 2011 - 2012
- Equipment Grant awarded by II-VI Foundation 2011
- Development of a Lead Free Die and Substrate Attach for High Temperature SiC Packages awarded by II-VI Foundation 2010 - 2011
- Micron Technology Foundation Grant awarded by Micron Foundation 2008 - 2011
- Silicon Carbide Inverters Phase III awarded by Global Power Electronics (GPE), Inc. 2009 - 2010
- Analysis of Substrate and Wire Bond Technologies for High Temperature SiC Packages awarded by II-VI Foundation 2009 - 2010
- Inertial Sensors Prototypes awarded by MET Tech, Inc. 2009
- Silicon Carbide Inverters: Phase II awarded by Global Power Electronics (GPE), Inc. 2009
- Electronic Packaging of SiC devices for High Temperature Operation awarded by II-VI Foundation 2008 - 2009
- Silicon Carbide Inverters awarded by Global Power Electronics (GPE), Inc. 2008
- LTCC Packaging for Laser Diode Bars awarded by Northrop Grumman 2007
- High Temperature Packaging of SiC Devices awarded by United States Department of Energy 2007
- LTCC Packaging for Laser Diode Bars awarded by Northrop Grumman 2006 - 2007
- High Temperature Packaging Study awarded by Freedom Car Program 2005 - 2006
- Microvia in LTCC awarded by Honeywell Federal Systems 2005
- Integrated Controllers for Automotive Auxiliary Electric Motors awarded by United States Department of Energy 2002 - 2003
- Characterization And Modeling of Embedded Passives In Low-Temperature Co-Fired Ceramic awarded by International Microelectronics And Packaging Society 2002 - 2003
- Low Temperature Co-Fired Ceramic (LTCC) Training Program awarded by Gintic Institute of Manufacturing Technology 2002
- High Performance On-Chip Decoupling Capacitors awarded by Integral Wave Technologies, Inc. 2000 - 2002
co-principal investigator on
- Prediction and Monitoring Systems of Creep-Fracture Behavior of 9Cr-1Mo Steels for Reactor Pressure Vessels awarded by Nuclear Energy University Programs (NEUP) 2009 - 2012
- Wafer-Level and Chip-Scale Packaging (WL-CSP) of MEMS awarded by National Science Foundation 2005 - 2007
- Power Packaging of Spray-Cooled SiC Devices for High Temperature and High Voltage Operation awarded by Office of Naval Research 2004 - 2007
- National Center for Reliable Electric Power Transmission (NCREPT) 2005
- Innovative Microwave Imaging System for Breast Cancer Detection awarded by Arkansas Biosciences Institute (ABI) 2004 - 2005
- Incorporating Recent Developments into Mixed- Signal / Telecommunications Curriculum awarded by National Science Foundation 2001 - 2004
- DOD-DEPSCOR: Direct Cooling of Propulsion Drives awarded by Office of Naval Research 2001 - 2003
- Enhancing Prototyping Capabilities for Electric Propulsion Research at the University of Arkansas awarded by Office of Naval Research 2000
Background
education and training
- B.S. in Physics and Applied Physics, Emory University
- M.S. in Electrical Engineering, Virginia Polytechnic Institute
- Ph.D. in Electrical Engineering, Virginia Polytechnic Institute
awards and honors
Contact
full name
- Fred Barlow, III