selected publications
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academic article
- A Die Attach Design for Thermoelectric Generator Packages for Automotive Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 11:134-143. 2021
- Time Delay Extraction from Frequency Domain Data Using Causal Fourier Continuations for High-Speed Interconnects. Electronics. 4:799-826. 2015
- Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects. IEEE Transactions on Components Packaging and Manufacturing Technology. 5:991-1005. 2015
- Causality verification using polynomial periodic continuations for electrical interconnects. Journal of Microelectronics and Electronic Packaging. 11. 2014
- Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC). Journal of Microelectronics and Electronic Packaging. 10:95-101. 2013
- Tunable Ferroelectric Capacitors Embedded Inside LTCC. Advancing Microelectronics. 40:20-23. 2013
- A Novel Design of Substrate Integrated Waveguide (SIW) E-Plane Inductive Strip Filter Implemented Using LTCC. Journal of Microelectronics and Electronic Packaging. 8. 2011
- A comparison of back grinding processes for bare silicon and through-silicon via wafers using numerical simulations. Journal of Microelectronics and Electronic Packaging. 8:146-153. 2011
- Fabrication of Precise Fluidic Structures in LTCC. International Journal of Applied Ceramic Technology. 6:18-23. 2009
- Fabrication of Micro Vias for LTCC Substrates. IEEE Transactions on Electronics Packaging Manufacturing. 29:32-41. 2006
- An Interdigital Bandpass Filter Embedded in LTCC for 5-GHz Wireless LAN Applications. IEEE Microwave and Wireless Components Letters. 15:357-359. 2005
- Low Cost Flex Substrates for Miniaturized Electronic Assemblies. Microelectronics Reliability Journal. 42:1091-1099. 2002
- Interfacial Thermal Resistance and Temperature Dependence of Three Adhesives for Electronic Packaging. IEEE Transactions on Components and Packaging Technologies. 23:633-637. 2000
- Getting Aggressive with Passive Devices. IEEE Circuits and Devices. 16:16-25. 2000
- An Overview to Integrated Power Module (IPM) Design for High Power Electronics Packaging. Microelectronics Reliability Journal. 40:365-379. 2000
- Integrated Power Modules (IPMs), A Novel MCM Approach to High Power Electronics Design and Packaging. International Journal of Microcircuits and Electronic Packaging. 21:274-278. 1998
- Thermal Evaluation and Comparison Study of Power Baseplate Materials. Advancing Microelectronics. 25:25-27. 1998
- Wideband Electrical Characterization of MCM Materials. Electronic Packaging and Production. 36:47-54. 1996
- Wideband Electrical Characterization of Materials Used in MCM Applications. International Journal of Microcircuits and Electronic Packaging. 19:281-287. 1996
- Comprehensive Evaluation of ITO Thick Films Produced Under Optimum Annealing Conditions. Solar Energy Materials and Solar Cells. 33:63-71. 1994
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chapter
- Ceramic Substrates. Advanced Electronic Packaging. IEEE. 1100. 2006
- Radio Frequency and Microwave Packaging. Advanced Electronic Packaging. IEEE. 2006
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conference paper
- A New Method for Causality Enforcement of DRAM Package Models Using Discrete Hilbert Transforms. 2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). 21-24. 2013
- Comparison of Passive Enforcement Techniques for DRAM Package Models. 2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). 25-28. 2013
- Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses. 2013 IEEE Workshop on Microelectronics and Electron Devices (WMED). 9-12. 2013
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patent disclosure